Redmi K70 Ultra Teased with IP68 Rating, Dimensity 9300+ Chip

BigGo Editorial Team
Redmi K70 Ultra Teased with IP68 Rating, Dimensity 9300+ Chip

Redmi K70 Ultra Teased with IP68 Rating and Powerful Specs

Xiaomi is gearing up to launch its latest flagship smartphone, the Redmi K70 Ultra, with some impressive features. Wang Teng, General Manager of Redmi, has officially teased the device on Chinese social media platform Weibo, revealing a key detail that's sure to excite potential buyers.

IP68 Water and Dust Resistance

The standout feature confirmed by Wang Teng is the K70 Ultra's IP68 rating for water and dust resistance. This certification means the device can:

  • Withstand submersion in fresh water up to 1.5 meters deep for 30 minutes
  • Offer complete protection against dust ingress

This level of durability is a significant upgrade for the Redmi K series and positions the K70 Ultra as a more robust option for users who lead active lifestyles or frequently use their phones in challenging environments.

Rumored Specifications

While Xiaomi hasn't officially confirmed all details, leaked information suggests the Redmi K70 Ultra will boast:

  • Processor: MediaTek Dimensity 9300+ SoC
  • Memory: Up to 24GB LPDDR5X RAM
  • Storage: Up to 1TB UFS 4.0
  • Battery: 5,500mAh with 120W wired fast charging
  • Display: 1.5K resolution OLED with 144Hz refresh rate
  • Camera: Triple rear camera setup (50MP + 8MP + 2MP)

Shift from Qualcomm

Interestingly, the choice of the MediaTek Dimensity 9300+ chipset marks a departure from the Snapdragon 8 Gen 3 used in the Redmi K70 Pro. This could signal a strategic shift in Redmi's processor partnerships for its ultra-premium devices.

Global Availability

While the Redmi K70 Ultra is likely to launch initially in China, there's speculation that it may serve as the basis for the global Xiaomi 14T Pro. This follows the pattern set by last year's K60 Ultra, which was adapted for international markets as the Xiaomi 13T Pro.

As Xiaomi continues to tease the Redmi K70 Ultra, we can expect more official information to surface in the coming weeks. The combination of high-end specifications and enhanced durability could make this device a compelling option in the competitive flagship smartphone market.