Cooler Master Launches Hyper 212 3DHP with Revolutionary 3D Heatpipe Technology at Same USD 29.99 Price

BigGo Editorial Team
Cooler Master Launches Hyper 212 3DHP with Revolutionary 3D Heatpipe Technology at Same USD 29.99 Price

Cooler Master has officially launched its latest iteration of the legendary Hyper 212 CPU cooler series, introducing groundbreaking 3D heatpipe technology that promises to revolutionize thermal performance in the budget cooling segment. The new Hyper 212 3DHP maintains the series' affordable pricing while delivering significantly improved heat dissipation capabilities through an ingeniously simple yet effective design innovation.

The Cooler Master Hyper 212 3DHP features groundbreaking 3D heatpipe technology for enhanced thermal performance
The Cooler Master Hyper 212 3DHP features groundbreaking 3D heatpipe technology for enhanced thermal performance

Revolutionary 3D Heatpipe Design Changes the Game

The core innovation behind the Hyper 212 3DHP lies in its reimagined heatpipe configuration. Traditional tower coolers rely on U-shaped heatpipes that run along the outer edges of the fin stack, leaving the center area relatively underutilized for heat dissipation. Cooler Master's 3D heatpipe technology addresses this limitation by introducing additional heatpipe branches that cut directly through the center of the fin stack, creating a trident-like configuration. This design ensures more even heat distribution across the entire heatsink surface, with each heatpipe handling less thermal load while covering a larger area of the fin stack.

Impressive Thermal Capacity Targets High-End CPUs

According to coverage from Hardware Buster during Computex 2025, the 3D heatpipe technology can handle up to 400 watts of thermal power. This exceptional capacity approaches the thermal limits of fully unlocked Intel CPUs, representing more than double the thermal design power of demanding devices like the PlayStation 5. The substantial thermal headroom positions the Hyper 212 3DHP as a viable cooling solution for high-performance processors while maintaining its budget-friendly positioning.

Two Variants Cater to Different Aesthetic Preferences

Cooler Master is releasing the Hyper 212 3DHP in two distinct variants to accommodate varying user preferences. The standard model features ARGB lighting effects for users who prioritize visual customization, while the Hyper 212 3DHP Black offers a more understated appearance with non-LED fans. Both variants share identical specifications and performance characteristics, ensuring users can choose based purely on aesthetic preferences without compromising cooling capability.

Specifications Deliver Balanced Performance and Quiet Operation

The Hyper 212 3DHP measures 133mm × 86mm × 158mm and incorporates six heatpipe ends at the top, utilizing two 3D heatpipes positioned on either side of the cooler. The included fans operate at speeds up to 2,050 RPM, generating 63.1 CFM of airflow with 2.69 mm H₂O static pressure. Despite the robust performance specifications, noise levels remain controlled at a maximum of 27 dBA, ensuring quiet operation even under demanding thermal loads.

Enhanced Value Proposition with Extended Warranty

Perhaps most remarkably, Cooler Master has maintained the USD 29.99 price point of the standard Hyper 212 models while incorporating the advanced 3D heatpipe technology. This pricing strategy demonstrates the company's commitment to making improved cooling performance accessible to budget-conscious builders. Additionally, the new 3DHP models include a generous five-year warranty, significantly extending coverage compared to the two-year warranty typically offered with standard Hyper 212 coolers.

Market Availability and Legacy Continuation

The Hyper 212 3DHP represents the latest evolution in a cooling solution that has served the PC building community for nearly two decades. While product pages are not yet live on Cooler Master's website, the coolers are expected to appear at retailers soon. This launch continues the Hyper 212's tradition of adapting to meet the thermal demands of each new generation of processors while maintaining its reputation as an accessible, reliable cooling solution for mainstream PC builds.